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RF Measurements of Die and Packages - Hardcover

RF Measurements of Die and Packages - Hardcover

9781580532730
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by Scott A. Wartenberg (Author)

This text is dedicated to the issues surrounding RFIC (radio-frequency integrated circuit) testing. It explains how to perform high-accuracy RF measurements of die and packages in the RF test lab. It defines the essential elements in an RF system, explains where errors can be found in such a system and shows how to mathematically remove them with calibration.

Number of Pages: 244
Dimensions: 0.85 x 9.26 x 6.36 IN
Publication Date: May 31, 2002