{"product_id":"semiconductor-wafer-bonding-science-and-technology-hardcover","title":"Semiconductor Wafer Bonding: Science and Technology - Hardcover","description":"\u003cp\u003eby \u003cb\u003eQ. -Y Tong\u003c\/b\u003e (Author), \u003cb\u003eU. Gösele\u003c\/b\u003e (Author)\u003c\/p\u003e\u003cp\u003eBonding - eine Technik zum \"Verschwei en\" von Halbleiter-Wafers ohne \"Klebstoff\" - wird in der Mikroelektronik, Energieelektronik, Mikromechanik, Optoelektronik und anderen Bereichen verbreitet eingesetzt. Dieser Band sammelt und systematisiert die in der Literatur verstreuten Informationen zum Wafer-Bonding; es finden sich beispielsweise Kapitel zum Bonding bei Raumtemperatur, zur Wärmebehandlung, zum Bonding ungleicher Materialien und strukturierter Wafers. (01\/99)\u003c\/p\u003e\u003ch3\u003eBack Jacket\u003c\/h3\u003e\u003cp\u003eA one-stop resource on all aspects of semiconductor wafer bonding for materials scientists and electrical engineers \u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e Semiconductor Wafer Bonding addresses the entire spectrum of mainstream and likely future applications of wafer bonding. It examines all of the important issues surrounding this technology, including basic interactions between flat surfaces, the influence of particles, surface steps and cavities, surface preparation and room-temperature wafer bonding, thermal treatment of bonded wafer pairs, and much more. \u003cp\u003e\u003c\/p\u003e This unique, one-stop resource consolidates information previously available only by time-consuming searches through technical journals, proceedings, and book chapters for more than 1,000 published articles on wafer bonding. It covers all materials used for wafer bonding-including silicon, III-V compounds, fused and crystalline quartz, glass, silicon carbide, sapphire, ferroelectrics, and many others. \u003cp\u003e\u003c\/p\u003e For materials scientists and electrical engineers who need to exploit the potential of this flourishing technology, Semiconductor Wafer Bonding is a convenient one-stop resource for answers to many common questions. It is also an excellent text\/reference for graduate students eager to learn about this interdisciplinary field, which spans surface chemistry, solid-state physics, materials science, and electrical engineering.\u003ch3\u003eAuthor Biography\u003c\/h3\u003e\u003cp\u003eQ.-Y. TONG is Professor and Director of the Microelectronics Center at Southeast University in Nanjing, China, and Adjunct Professor at Duke University's School of Engineering. Currently, he is also the manager of the Wafer Bonding Lab at the Research Triangle Institute. He was formerly a consultant at the Max-Planck-Institute of Microstructure Physics. \u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e U. GÖSELE, PhD, is Director at the Max-Planck-Institute of Microstructure Physics in Halle, Germany, and J.B. Duke Professor of Materials Science at Duke University's School of Engineering in Durham, North Carolina.\n        \u003cdiv\u003e\n\u003cstrong\u003eNumber of Pages:\u003c\/strong\u003e 320\u003c\/div\u003e\n            \u003cdiv\u003e\n\u003cstrong\u003eDimensions:\u003c\/strong\u003e 0.78 x 9.6 x 5.98 IN\u003c\/div\u003e\n            \u003cdiv\u003e\n\u003cstrong\u003eIllustrated:\u003c\/strong\u003e Yes\u003c\/div\u003e\n            \u003cdiv\u003e\n\u003cstrong\u003ePublication Date:\u003c\/strong\u003e December 07, 1998\u003c\/div\u003e\n            ","brand":"Books by splitShops","offers":[{"title":"Default Title","offer_id":42744911953983,"sku":"9780471574811","price":345.52,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0105\/8226\/1823\/files\/ccaf7268eb2eefed19f5261c91d2a246.webp?v=1765170169","url":"https:\/\/dhlswag.com\/products\/semiconductor-wafer-bonding-science-and-technology-hardcover","provider":"BBB","version":"1.0","type":"link"}